Conference Agenda

19th Electronics Packaging Technology Conference

Date: Thursday, 07/Dec/2017
10:30am
-
11:50am
S-04: Mechanical modeling & simulation
Location: Lyrebird Room
Chair: Christopher Bailey
1:20pm
-
1:50pm
Invited-04: UV Laser Releasable Temporary Bonding Materials for Advanced Packaging technologies : Dr. Kenzo Ohkita(JSR)
Location: Lyrebird Room
1:50pm
-
3:10pm
S-09: Material and Processing
Location: Lyrebird Room
Chair: Ramachandran Krishnan Trichur
4:30pm
-
5:50pm
S-14: Emerging Technologies
Location: Lyrebird Room
Chair: Cher Ming Tan

Date: Friday, 08/Dec/2017
8:30am
-
9:00am
Invited-09: On-Chip Embedded Cooling of Power and Logic Components : Dr. Avram Bar-Cohen(Raytheon Corporation)
Location: Lyrebird Room
9:00am
-
10:20am
S-19: Thermal Characterization & cooling solutions
Location: Lyrebird Room
Chair: GONG YUE TANG
11:10am
-
12:30pm
S-24: Electrical Simulations & Characterization
Location: Lyrebird Room
Chair: Eldon Staggs
1:30pm
-
2:00pm
Invited-14: Heterogeneous Integration Roadmap – Global Collaboration : William Chen(ASE, IEEE Electronic Packaging Society)
Location: Lyrebird Room
2:00pm
-
3:20pm
S-29: Emerging Technologies
Location: Lyrebird Room
Chair: Jun Su Lee