Conference Agenda

19th Electronics Packaging Technology Conference

Date: Wednesday, 06/Dec/2017
8:30am
-
12:00pm
PDC 3: MEMS Fabrication: from theory to packaging by Dr. Liu Aiqun
Location: Swallow Room
1:30pm
-
5:00pm
PDC 6: Advanced LED packaging technology and reliability by Dr. Ricky Lee
Location: Swallow Room

Date: Thursday, 07/Dec/2017
10:30am
-
11:50am
S-03: Material and Processing
Location: Swallow Room
Chair: Sungdong Kim
1:20pm
-
1:50pm
Invited-03: Innovative Process and Equipment Technology Solutions for 3D SiP Packaging : Albert Lan(Applied Material)
Location: Swallow Room
1:50pm
-
3:10pm
S-08: Equipment and Process automation
Location: Swallow Room
Chair: Eric Pabo
4:30pm
-
5:50pm
S-13: Thermal Characterization & cooling solutions
Location: Swallow Room
Chair: Marta Rencz

Date: Friday, 08/Dec/2017
8:30am
-
9:00am
Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes : Ram Trichur(Brewer Science)
Location: Swallow Room
9:00am
-
10:20am
S-18: Material and Processing
Location: Swallow Room
Chair: Rajoo Ranjan
11:10am
-
12:30pm
S-23: TSV/Wafer Level Packaging
Location: Swallow Room
Chair: Boo Yang Jung
1:30pm
-
2:00pm
Invited-13: 10 Golden Rules of Chip- Package- Board Interactions : Dr. E.Napetschnig(Infineon Technologies Austria)
Location: Swallow Room
2:00pm
-
3:20pm
S-28: Interconnection Technologies
Location: Swallow Room
Chair: Guilian Gao