Conference Agenda

19th Electronics Packaging Technology Conference

Date: Wednesday, 06/Dec/2017
8:30am
-
12:00pm
PDC 2: Automotive electronics – requirements and reliability by Dr. Mervi Paulasto-Kröckel
Location: Cardinal Room
1:30pm
-
5:00pm
PDC 5: Reliability from a Semiconductor Suppliers Perspective by Dr. Stevan Hunter
Location: Cardinal Room

Date: Thursday, 07/Dec/2017
10:30am
-
11:50am
S-02: Interconnection Technologies
Location: Cardinal Room
Chair: Thomas Zerna
1:20pm
-
1:50pm
Invited-02: Packaging of Integrated Silicon Photonics devices : Electrical, Optical, Thermal Challenges and Application : Dr. Jun Su Lee(Tyndall National Institute)
Location: Cardinal Room
1:50pm
-
3:10pm
S-07: Emerging Technologies
Location: Cardinal Room
Chair: Hideyuki Nasu
4:30pm
-
5:50pm
S-12: Quality, Reliability & FA
Location: Cardinal Room
Chair: Karsten Meier

Date: Friday, 08/Dec/2017
8:30am
-
9:00am
Invited-07: VCSEL-based Optical Interconnects and Their Packaging Technologies : Dr. Hideyuki Nasu(Furukawa Electric Co)
Location: Cardinal Room
9:00am
-
10:20am
S-17: Emerging Technologies
Location: Cardinal Room
Chair: Yan Cheong Chan
11:10am
-
12:30pm
S-22: Advanced Packaging
Location: Cardinal Room
Chair: Jean Charbonnier
1:30pm
-
2:00pm
Invited-12: Highly accurate TSV, PWB and FO-PLP wiring fabication by plasma dry processes for interface : Dr. Yasuhiro Morikawa(ULVAC)
Location: Cardinal Room
2:00pm
-
3:20pm
S-27: TSV/Wafer Level Packaging
Location: Cardinal Room
Chair: INDERJIT SINGH