Conference Agenda

19th Electronics Packaging Technology Conference

Date: Wednesday, 06/Dec/2017
8:30am
-
12:00pm
PDC 1: Electronic Packaging for 5G Microwave and Millimeter Wave Systems IEEE by Dr. Rick Sturdivant
Location: Paradiso Room
1:30pm
-
5:00pm
PDC 4: Fan-Out Wafer-Level Packaging and 3D Packaging by Dr. John H Lau
Location: Paradiso Room

Date: Thursday, 07/Dec/2017
10:30am
-
11:50am
S-01: TSV/Wafer Level Packaging
Location: Paradiso Room
Chair: Avram Bar-Cohen
1:20pm
-
1:50pm
Invited-01: Enhanced Bonding Technology for Hybrid Integration in 3D Packaging Technology : Dr. Guilian Gao(Xperi)
Location: Paradiso Room
1:50pm
-
3:10pm
S-06: Advanced packaging
Location: Paradiso Room
Chair: Martin Oppermann
4:30pm
-
5:50pm
S-11: Mechanical modeling & simulation
Location: Paradiso Room
Chair: Santosh Kumar

Date: Friday, 08/Dec/2017
8:30am
-
9:00am
Invited-06: Wafer Bonding – An Enabling Technology for 3DIC, MEMS, BSI CIS, SOI, RF Filters, and More : Eric Pabo(EVG)
Location: Paradiso Room
9:00am
-
10:20am
S-16: Interconnection Technologies
Location: Paradiso Room
Chair: Chan Pin Chong
11:10am
-
12:30pm
S-21: Materials and Processing
Location: Paradiso Room
Chair: Kenzo Ohkita
1:30pm
-
2:00pm
Invited-11: Advanced eWLB FOWLP: Enabling Integrated Packaging Solutions : Dr. Seung Wook Yoon(STATS ChipPAC)
Location: Paradiso Room
2:00pm
-
3:20pm
S-26: Advanced Packaging
Location: Paradiso Room