Conference Agenda

19th Electronics Packaging Technology Conference

Date: Wednesday, 06/Dec/2017
7:00am
-
8:30am
PDC Registration
8:30am
-
12:00pm
PDC 1: Electronic Packaging for 5G Microwave and Millimeter Wave Systems IEEE by Dr. Rick Sturdivant
Location: Paradiso Room
PDC 2: Automotive electronics – requirements and reliability by Dr. Mervi Paulasto-Kröckel
Location: Cardinal Room
PDC 3: MEMS Fabrication: from theory to packaging by Dr. Liu Aiqun
Location: Swallow Room
12:00pm
-
1:30pm
Lunch
1:30pm
-
5:00pm
PDC 4: Fan-Out Wafer-Level Packaging and 3D Packaging by Dr. John H Lau
Location: Paradiso Room
PDC 5: Reliability from a Semiconductor Suppliers Perspective by Dr. Stevan Hunter
Location: Cardinal Room
PDC 6: Advanced LED packaging technology and reliability by Dr. Ricky Lee
Location: Swallow Room
5:30pm
-
7:30pm
Panel Session: Packaging Challenges & Opportunities of 5G-mm Wave Technology
Location: Galleria Ballroom
7:30pm
-
10:00pm
Dinner: VIP